CHPPE Ribbon Cutting Ceremony
A Ribbon Cutting Ceremony will be hosted by the Center for High Performance Power Electronics (CHPPE) at The Ohio State. This event heralds the completion of our new research facilities at the heart of The Ohio State University main campus. This celebration will include tours of our new state-of-the-art Hardware-in-the-Loop (HIL) classroom/simulation laboratory, our expansive EMI/EMC, Device Testing & Characterization, High Power Testing and Dynostand facilities located in Caldwell Hall. Tours will be preceded by brief presentations on planned research by representatives from OSU, ODOD, and private industrial partners. Guests from industry, universities, and national laboratories with common interests will also have an opportunity to exchange ideas and establish new relationships. The Ribbon Cutting Ceremony will take place on Wednesday, Oct 30th from 9:30 AM - 2 P.M. Enjoy morning refreshments in Dreese Labs (http://www.osu.edu/map/building.php?building=279) followed by a formal ribbon-cutting ceremony and tours in our research CHPPE facilities. We will conclude the ceremony with brief presentations and a lunch at The Ohio State University Blackwell Hotel, Pfahl Hall Room 140 (http://www.osu.edu/map/building.php?building=254).